BibTeX record journals/mr/LinNCCTM04

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@article{DBLP:journals/mr/LinNCCTM04,
  author       = {T. Y. Lin and
                  B. Njoman and
                  D. Crouthamel and
                  K. H. Chua and
                  S. Y. Teo and
                  Y. Y. Ma},
  title        = {The impact of moisture in mold compound preforms on the warpage of
                  {PBGA} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {4},
  pages        = {603--609},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.08.003},
  doi          = {10.1016/J.MICROREL.2003.08.003},
  timestamp    = {Sat, 22 Feb 2020 19:28:42 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LinNCCTM04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}