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BibTeX record journals/mr/LinLCOMPC02
@article{DBLP:journals/mr/LinLCOMPC02, author = {T. Y. Lin and W. S. Leong and K. H. Chua and R. Oh and Y. Miao and J. S. Pan and J. W. Chai}, title = {The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method}, journal = {Microelectron. Reliab.}, volume = {42}, number = {3}, pages = {375--380}, year = {2002}, url = {https://doi.org/10.1016/S0026-2714(02)00003-3}, doi = {10.1016/S0026-2714(02)00003-3}, timestamp = {Sat, 22 Feb 2020 19:26:47 +0100}, biburl = {https://dblp.org/rec/journals/mr/LinLCOMPC02.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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