BibTeX record journals/mr/LinDLCYPCTT03

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@article{DBLP:journals/mr/LinDLCYPCTT03,
  author       = {T. Y. Lin and
                  K. L. Davison and
                  W. S. Leong and
                  Simon Chua and
                  Y. F. Yao and
                  J. S. Pan and
                  J. W. Chai and
                  K. C. Toh and
                  W. C. Tjiu},
  title        = {Surface topographical characterization of silver-plated film on the
                  wedge bondability of leaded {IC} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {5},
  pages        = {803--809},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00037-4},
  doi          = {10.1016/S0026-2714(03)00037-4},
  timestamp    = {Sat, 22 Feb 2020 19:28:24 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LinDLCYPCTT03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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