BibTeX record journals/mr/LaurilaMVKLSK07

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@article{DBLP:journals/mr/LaurilaMVKLSK07,
  author       = {Tomi Laurila and
                  Toni T. Mattila and
                  Vesa Vuorinen and
                  Juha Karppinen and
                  Jue Li and
                  Mika Sippola and
                  Jorma K. Kivilahti},
  title        = {Evolution of microstructure and failure mechanism of lead-free solder
                  interconnections in power cycling and thermal shock tests},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {7},
  pages        = {1135--1144},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2006.07.095},
  doi          = {10.1016/J.MICROREL.2006.07.095},
  timestamp    = {Thu, 03 Mar 2022 09:12:54 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LaurilaMVKLSK07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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