BibTeX record journals/mr/LaiW05

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@article{DBLP:journals/mr/LaiW05,
  author       = {Yi{-}Shao Lai and
                  Tong Hong Wang},
  title        = {Verification of submodeling technique in thermomechanical reliability
                  assessment of flip-chip package assembly},
  journal      = {Microelectron. Reliab.},
  volume       = {45},
  number       = {3-4},
  pages        = {575--582},
  year         = {2005},
  url          = {https://doi.org/10.1016/j.microrel.2004.09.007},
  doi          = {10.1016/J.MICROREL.2004.09.007},
  timestamp    = {Sat, 22 Feb 2020 19:29:06 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LaiW05.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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