BibTeX record journals/mr/LaiCKLC07

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@article{DBLP:journals/mr/LaiCKLC07,
  author       = {Yi{-}Shao Lai and
                  Kuo{-}Ming Chen and
                  Chin{-}Li Kao and
                  Chiu{-}Wen Lee and
                  Ying{-}Ta Chiu},
  title        = {Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite
                  flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {8},
  pages        = {1273--1279},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2006.09.023},
  doi          = {10.1016/J.MICROREL.2006.09.023},
  timestamp    = {Sat, 22 Feb 2020 19:29:14 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LaiCKLC07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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