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BibTeX record journals/mr/LaiCKLC07
@article{DBLP:journals/mr/LaiCKLC07, author = {Yi{-}Shao Lai and Kuo{-}Ming Chen and Chin{-}Li Kao and Chiu{-}Wen Lee and Ying{-}Ta Chiu}, title = {Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy}, journal = {Microelectron. Reliab.}, volume = {47}, number = {8}, pages = {1273--1279}, year = {2007}, url = {https://doi.org/10.1016/j.microrel.2006.09.023}, doi = {10.1016/J.MICROREL.2006.09.023}, timestamp = {Sat, 22 Feb 2020 19:29:14 +0100}, biburl = {https://dblp.org/rec/journals/mr/LaiCKLC07.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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