BibTeX record journals/mr/KunwarSRWGCMSZ18

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@article{DBLP:journals/mr/KunwarSRWGCMSZ18,
  author       = {Anil Kunwar and
                  Shengyan Shang and
                  Peter R{\aa}back and
                  Yunpeng Wang and
                  Julien Givernaud and
                  Jun Chen and
                  Haitao Ma and
                  Xueguan Song and
                  Ning Zhao},
  title        = {Heat and mass transfer effects of laser soldering on growth behavior
                  of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu
                  joints},
  journal      = {Microelectron. Reliab.},
  volume       = {80},
  pages        = {55--67},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2017.11.016},
  doi          = {10.1016/J.MICROREL.2017.11.016},
  timestamp    = {Sat, 22 Feb 2020 19:29:13 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KunwarSRWGCMSZ18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}