<?xml version="1.0"?>
<dblp>
<article key="journals/mr/KoneGHMMLZNRG11" mdate="2012-11-15">
<author>G. A. Kon&#233;</author>
<author>Brice Grandchamp</author>
<author>C. Hainaut</author>
<author>Fran&#231;ois Marc</author>
<author>C. Maneux</author>
<author>Nathalie Labat</author>
<author>Thomas Zimmer</author>
<author>Virginie Nodjiadjim</author>
<author>Muriel Riet</author>
<author>Jean Godin</author>
<title>Reliability of submicron InGaAs/InP DHBT under thermal and electrical stresses.</title>
<pages>1730-1735</pages>
<year>2011</year>
<volume>51</volume>
<journal>Microelectronics Reliability</journal>
<number>9-11</number>
<ee>http://dx.doi.org/10.1016/j.microrel.2011.07.073</ee>
<url>db/journals/mr/mr51.html#KoneGHMMLZNRG11</url>
</article>
</dblp>
