BibTeX record journals/mr/KimJHHKJ08

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@article{DBLP:journals/mr/KimJHHKJ08,
  author       = {Jong{-}Woong Kim and
                  Jin{-}Kyu Jang and
                  Sang{-}Ok Ha and
                  Sang{-}Su Ha and
                  Dae{-}Gon Kim and
                  Seung{-}Boo Jung},
  title        = {Effect of high-speed loading conditions on the fracture mode of the
                  {BGA} solder joint},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {11-12},
  pages        = {1882--1889},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2008.07.066},
  doi          = {10.1016/J.MICROREL.2008.07.066},
  timestamp    = {Sat, 22 Feb 2020 19:26:47 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KimJHHKJ08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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