DBLP BibTeX Record 'journals/mr/KimJHHKJ08'

@article{DBLP:journals/mr/KimJHHKJ08,
  author    = {Jong-Woong Kim and
               Jin-Kyu Jang and
               Sang-Ok Ha and
               Sang-Su Ha and
               Dae-Gon Kim and
               Seung-Boo Jung},
  title     = {Effect of high-speed loading conditions on the fracture
               mode of the BGA solder joint},
  journal   = {Microelectronics Reliability},
  volume    = {48},
  number    = {11-12},
  year      = {2008},
  pages     = {1882-1889},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2008.07.066},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}