BibTeX record: journals/mr/KimJHHKJ08

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@article{DBLP:journals/mr/KimJHHKJ08,
  author    = {Jong{-}Woong Kim and
               Jin{-}Kyu Jang and
               Sang{-}Ok Ha and
               Sang{-}Su Ha and
               Dae{-}Gon Kim and
               Seung{-}Boo Jung},
  title     = {Effect of high-speed loading conditions on the fracture mode of the
               {BGA} solder joint},
  journal   = {Microelectronics Reliability},
  volume    = {48},
  number    = {11-12},
  pages     = {1882--1889},
  year      = {2008},
  url       = {http://dx.doi.org/10.1016/j.microrel.2008.07.066},
  doi       = {10.1016/j.microrel.2008.07.066},
  timestamp = {Mon, 27 Sep 2010 12:34:56 +0200},
  biburl    = {http://dblp.uni-trier.de/rec/bib/journals/mr/KimJHHKJ08},
  bibsource = {dblp computer science bibliography, http://dblp.org}
}