Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.

K. S. Kim S. H. Huh K. Suganuma Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. 259-267 2003 43 Microelectronics Reliability 2 http://dx.doi.org/10.1016/S0026-2714(02)00239-1 db/journals/mr/mr43.html#KimHS03