@article{DBLP:journals/mr/KhooTV03,
author = {Sherry Suat Cheng Khoo and
Pee Ya Tan and
Steven H. Voldman},
title = {Microanalysis and electromigration reliability performance
of high current transmission line pulse (TLP) stressed copper
interconnects},
journal = {Microelectronics Reliability},
volume = {43},
number = {7},
year = {2003},
pages = {1039-1045},
ee = {http://dx.doi.org/10.1016/S0026-2714(03)00133-1},
bibsource = {DBLP, http://dblp.uni-trier.de}
}