@article{DBLP:journals/mr/KeserWW04,
author = {Beth Keser and
Li Wetz and
Jerry White},
title = {WL-CSP reliability with various solder alloys and die thicknesses},
journal = {Microelectronics Reliability},
volume = {44},
number = {3},
year = {2004},
pages = {521-531},
ee = {http://dx.doi.org/10.1016/S0026-2714(03)00220-8},
bibsource = {DBLP, http://dblp.uni-trier.de}
}