@article{DBLP:journals/mr/KandasamyM08,
author = {Ravi Kandasamy and
A. S. Mujumdar},
title = {Thermal analysis of a flip chip ceramic ball grid array
(CBGA) package},
journal = {Microelectronics Reliability},
volume = {48},
number = {2},
year = {2008},
pages = {261-273},
ee = {http://dx.doi.org/10.1016/j.microrel.2007.05.005},
bibsource = {DBLP, http://dblp.uni-trier.de}
}