BibTeX record journals/mr/JangPLP12

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@article{DBLP:journals/mr/JangPLP12,
  author       = {Kyung{-}Woon Jang and
                  Jin{-}Hyoung Park and
                  Soon{-}Bok Lee and
                  Kyung{-}Wook Paik},
  title        = {A study on thermal cycling {(T/C)} reliability of anisotropic conductive
                  film {(ACF)} flip chip assembly for thin chip-on-board {(COB)} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {6},
  pages        = {1174--1181},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2011.12.022},
  doi          = {10.1016/J.MICROREL.2011.12.022},
  timestamp    = {Sat, 22 Feb 2020 19:27:39 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/JangPLP12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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