BibTeX record journals/mr/JangLBBF12

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@article{DBLP:journals/mr/JangLBBF12,
  author       = {J. W. Jang and
                  L. Li and
                  P. Bowles and
                  R. Bonda and
                  D. R. Frear},
  title        = {High-lead flip chip bump cracking on the thin organic substrate in
                  a module package},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {2},
  pages        = {455--460},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2011.09.024},
  doi          = {10.1016/J.MICROREL.2011.09.024},
  timestamp    = {Sat, 22 Feb 2020 19:27:33 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/JangLBBF12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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