BibTeX record journals/mr/HwangYP08

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@article{DBLP:journals/mr/HwangYP08,
  author       = {J. S. Hwang and
                  M. J. Yim and
                  K. W. Paik},
  title        = {Effects of bonding temperature on the properties and reliabilities
                  of anisotropic conductive films (ACFs) for flip chip on organic substrate
                  application},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {2},
  pages        = {293--299},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2006.07.097},
  doi          = {10.1016/J.MICROREL.2006.07.097},
  timestamp    = {Sat, 22 Feb 2020 19:27:08 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HwangYP08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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