DBLP BibTeX Record 'journals/mr/HuangLS02'

@article{DBLP:journals/mr/HuangLS02,
  author    = {Wei Huang and
               James M. Loman and
               B{\"u}lent Sener},
  title     = {Study of the effect of reflow time and temperature on Cu-Sn
               intermetallic compound layer reliability},
  journal   = {Microelectronics Reliability},
  volume    = {42},
  number    = {8},
  year      = {2002},
  pages     = {1229-1234},
  ee        = {http://dx.doi.org/10.1016/S0026-2714(02)00090-2},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}