BibTeX record: journals/mr/HuangLS02

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@article{DBLP:journals/mr/HuangLS02,
  author    = {Wei Huang and
               James M. Loman and
               B{\"{u}}lent Sener},
  title     = {Study of the effect of reflow time and temperature on Cu-Sn intermetallic
               compound layer reliability},
  journal   = {Microelectronics Reliability},
  year      = {2002},
  volume    = {42},
  number    = {8},
  pages     = {1229--1234},
  url       = {http://dx.doi.org/10.1016/S0026-2714(02)00090-2},
  doi       = {10.1016/S0026-2714(02)00090-2},
  timestamp = {Sat, 25 Oct 2014 21:12:25 +0200},
  biburl    = {http://dblp.uni-trier.de/rec/bib/journals/mr/HuangLS02},
  bibsource = {dblp computer science bibliography, http://dblp.org}
}