BibTeX record journals/mr/HuJSLCZ18

download as .bib file

@article{DBLP:journals/mr/HuJSLCZ18,
  author       = {Jiaxing Hu and
                  Bo Jing and
                  Zengjin Sheng and
                  Fang Lu and
                  Yaojun Chen and
                  Yulin Zhang},
  title        = {Failure and failure characterization of {QFP} package interconnect
                  structure under random vibration condition},
  journal      = {Microelectron. Reliab.},
  volume       = {91},
  pages        = {120--127},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.08.011},
  doi          = {10.1016/J.MICROREL.2018.08.011},
  timestamp    = {Sat, 22 Feb 2020 19:28:21 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HuJSLCZ18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.