Wafer level packaging of a tape flip-chip chip scale packages.

Greg Hotchkiss Gonzalo Amador Darvin Edwards Paul Hundt Les Stark Roger Stierman Gail Heinen Wafer level packaging of a tape flip-chip chip scale packages. 705-713 2001 41 Microelectronics Reliability 5 http://dx.doi.org/10.1016/S0026-2714(00)00261-4 db/journals/mr/mr41.html#HotchkissAEHSSH01