HoWDZD04'

BibTeX

@article{DBLP:journals/mr/HoWDZD04,
  author    = {Paul S. Ho and
               Guotao Wang and
               Min Ding and
               Jie-Hua Zhao and
               Xiang Dai},
  title     = {Reliability issues for flip-chip packages},
  journal   = {Microelectronics Reliability},
  volume    = {44},
  number    = {5},
  year      = {2004},
  pages     = {719-737},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2004.01.007},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}