BibTeX record journals/mr/HammadI17

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@article{DBLP:journals/mr/HammadI17,
  author       = {A. E. Hammad and
                  A. A. Ibrahiem},
  title        = {Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu
                  solder alloy by reinforcing nano-sized ZnO particles},
  journal      = {Microelectron. Reliab.},
  volume       = {75},
  pages        = {187--194},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.07.034},
  doi          = {10.1016/J.MICROREL.2017.07.034},
  timestamp    = {Mon, 26 Oct 2020 08:59:23 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HammadI17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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