Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages.

Jason Y. L. Goh Mark C. Pitter Chung W. See Michael G. Somekh Daniel Vanderstraeten Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. 259-267 2004 44 Microelectronics Reliability 2 http://dx.doi.org/10.1016/S0026-2714(03)00162-8 db/journals/mr/mr44.html#GohPSSV04