BibTeX record journals/mr/EndeWKSSCB14

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@article{DBLP:journals/mr/EndeWKSSCB14,
  author       = {D. A. van den Ende and
                  H. J. van de Wiel and
                  Roel H. L. Kusters and
                  Ashok Sridhar and
                  J. F. M. Schram and
                  Maarten Cauwe and
                  Jeroen van den Brand},
  title        = {Mechanical and electrical properties of ultra-thin chips and flexible
                  electronics assemblies during bending},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {12},
  pages        = {2860--2870},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.07.125},
  doi          = {10.1016/J.MICROREL.2014.07.125},
  timestamp    = {Tue, 27 Oct 2020 08:09:19 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/EndeWKSSCB14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}