BibTeX record journals/mr/DugalC17

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@article{DBLP:journals/mr/DugalC17,
  author       = {Franc Dugal and
                  Mauro Ciappa},
  title        = {Reliability investigation of the copper-zinc system for solid diffusion
                  bonding in power modules},
  journal      = {Microelectron. Reliab.},
  volume       = {76-77},
  pages        = {460--464},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.07.023},
  doi          = {10.1016/J.MICROREL.2017.07.023},
  timestamp    = {Sat, 22 Feb 2020 19:27:58 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/DugalC17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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