BibTeX record journals/mr/ChinLYT08

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@article{DBLP:journals/mr/ChinLYT08,
  author       = {Y. T. Chin and
                  P. K. Lam and
                  H. K. Yow and
                  Teck Yong Tou},
  title        = {Investigation of mechanical shock testing of lead-free {SAC} solder
                  joints in fine pitch {BGA} package},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {7},
  pages        = {1079--1086},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2008.04.003},
  doi          = {10.1016/J.MICROREL.2008.04.003},
  timestamp    = {Wed, 05 Jan 2022 09:00:20 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChinLYT08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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