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BibTeX record journals/mr/ChienCLHWY08
@article{DBLP:journals/mr/ChienCLHWY08, author = {Chi{-}Hui Chien and Thaiping Chen and Wei{-}Bang Lin and Chi{-}Chang Hsieh and Yii{-}Der Wu and Cheng{-}Hsiu Yeh}, title = {Experimental and statistical study in adhesion features of bonded interfaces of {IC} packages}, journal = {Microelectron. Reliab.}, volume = {48}, number = {1}, pages = {140--148}, year = {2008}, url = {https://doi.org/10.1016/j.microrel.2007.03.002}, doi = {10.1016/J.MICROREL.2007.03.002}, timestamp = {Sat, 22 Feb 2020 19:26:58 +0100}, biburl = {https://dblp.org/rec/journals/mr/ChienCLHWY08.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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