BibTeX record journals/mr/ChengHHC16

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@article{DBLP:journals/mr/ChengHHC16,
  author       = {Hsien{-}Chie Cheng and
                  Tzu{-}Chin Huang and
                  Po{-}Wen Hwang and
                  Wen{-}Hwa Chen},
  title        = {Heat dissipation assessment of through silicon via (TSV)-based 3D
                  {IC} packaging for {CMOS} image sensing},
  journal      = {Microelectron. Reliab.},
  volume       = {59},
  pages        = {84--94},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2015.12.028},
  doi          = {10.1016/J.MICROREL.2015.12.028},
  timestamp    = {Sat, 22 Feb 2020 19:28:08 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChengHHC16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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