@article{DBLP:journals/mr/ChenZJL06,
  author    = {Xu Chen and
               Jun Zhang and
               Chunlei Jiao and
               Yanmin Liu},
  title     = {Effects of different bonding parameters on the electrical
               performance and peeling strengths of ACF interconnection},
  journal   = {Microelectronics Reliability},
  volume    = {46},
  number    = {5-6},
  year      = {2006},
  pages     = {774-785},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2005.07.115},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}