BibTeX record journals/mr/ChenYCTL13

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@article{DBLP:journals/mr/ChenYCTL13,
  author       = {Wen{-}Hwa Chen and
                  Ching{-}Feng Yu and
                  Hsien{-}Chie Cheng and
                  Yu{-}min Tsai and
                  Su{-}Tsai Lu},
  title        = {{IMC} growth reaction and its effects on solder joint thermal cycling
                  reliability of 3D chip stacking packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {1},
  pages        = {30--40},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2012.06.146},
  doi          = {10.1016/J.MICROREL.2012.06.146},
  timestamp    = {Sat, 22 Feb 2020 19:29:20 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChenYCTL13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}