BibTeX record journals/mr/ChenWL06

download as .bib file

@article{DBLP:journals/mr/ChenWL06,
  author       = {Hongtao Chen and
                  C. Q. Wang and
                  M. Y. Li},
  title        = {Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint
                  reliability under thermal cycling},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {8},
  pages        = {1348--1356},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.12.001},
  doi          = {10.1016/J.MICROREL.2005.12.001},
  timestamp    = {Wed, 21 Jun 2023 09:08:16 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/ChenWL06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.