BibTeX record journals/mr/ChenLHH10

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@article{DBLP:journals/mr/ChenLHH10,
  author       = {Jiunn Chen and
                  Yi{-}Shao Lai and
                  Chueh{-}An Hsieh and
                  Chia Yi Hu},
  title        = {Redistribution in wafer level chip size packaging technology for high
                  power device applications: Process and design considerations},
  journal      = {Microelectron. Reliab.},
  volume       = {50},
  number       = {4},
  pages        = {522--527},
  year         = {2010},
  url          = {https://doi.org/10.1016/j.microrel.2009.10.004},
  doi          = {10.1016/J.MICROREL.2009.10.004},
  timestamp    = {Sat, 22 Feb 2020 19:27:52 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChenLHH10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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