BibTeX record journals/mr/ChanL02a

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@article{DBLP:journals/mr/ChanL02a,
  author       = {Y. C. Chan and
                  D. Y. Luk},
  title        = {Effects of bonding parameters on the reliability performance of anisotropic
                  conductive adhesive interconnects for flip-chip-on-flex packages assembly
                  {II.} Different bonding pressure},
  journal      = {Microelectron. Reliab.},
  volume       = {42},
  number       = {8},
  pages        = {1195--1204},
  year         = {2002},
  url          = {https://doi.org/10.1016/S0026-2714(02)00089-6},
  doi          = {10.1016/S0026-2714(02)00089-6},
  timestamp    = {Sat, 22 Feb 2020 19:27:12 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChanL02a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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