<?xml version="1.0"?>
<dblp>
<article key="journals/mj/LiuCXJXHZZL08" mdate="2010-09-15">
<author>Mingjun Liu</author>
<author>Ping Chen</author>
<author>Qin Xue</author>
<author>Fangfang Jiang</author>
<author>Guohua Xie</author>
<author>Jingying Hou</author>
<author>Yi Zhao</author>
<author>Liying Zhang</author>
<author>Bin Li</author>
<title>Influence of connecting units' thicknesses on tandem organic devices' performances.</title>
<pages>1622-1625</pages>
<year>2008</year>
<volume>39</volume>
<journal>Microelectronics Journal</journal>
<number>12</number>
<ee>http://dx.doi.org/10.1016/j.mejo.2008.02.018</ee>
<url>db/journals/mj/mj39.html#LiuCXJXHZZL08</url>
</article>
</dblp>
