BibTeX record journals/ijmtm/WuSPXS08

download as .bib file

@article{DBLP:journals/ijmtm/WuSPXS08,
  author       = {Jian (Jessie) Wu and
                  Xuekun Sun and
                  Z. J. Pei and
                  X. Jack Xin and
                  Kelli Simmelink},
  title        = {Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element
                  analysis with designed experiments},
  journal      = {Int. J. Manuf. Technol. Manag.},
  volume       = {13},
  number       = {2/3/4},
  pages        = {169--186},
  year         = {2008},
  url          = {https://doi.org/10.1504/IJMTM.2008.016769},
  doi          = {10.1504/IJMTM.2008.016769},
  timestamp    = {Thu, 04 Jun 2020 19:36:16 +0200},
  biburl       = {https://dblp.org/rec/journals/ijmtm/WuSPXS08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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