BibTeX record journals/ijmtm/PingS09

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@article{DBLP:journals/ijmtm/PingS09,
  author       = {Yang Ping and
                  Caijun Shen},
  title        = {Finite element analysis on stress/strain in {CBGA} solder joint with
                  different substrates under thermal cycle},
  journal      = {Int. J. Manuf. Technol. Manag.},
  volume       = {18},
  number       = {3},
  pages        = {333--339},
  year         = {2009},
  url          = {https://doi.org/10.1504/IJMTM.2009.026393},
  doi          = {10.1504/IJMTM.2009.026393},
  timestamp    = {Thu, 04 Jun 2020 19:36:33 +0200},
  biburl       = {https://dblp.org/rec/journals/ijmtm/PingS09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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