ChenCS06'

@article{DBLP:journals/ijia/ChenCS06,
  author    = {Liguo Chen and
               Tao Chen and
               Lining Sun},
  title     = {The bond Strength Measurement of silicon-silicon bonding
               wafers Based on Crack Opening Method},
  journal   = {I. J. Information Acquisition},
  volume    = {3},
  number    = {4},
  year      = {2006},
  pages     = {339-347},
  ee        = {http://dx.doi.org/10.1142/S0219878906001088},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}