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BibTeX record journals/ijces/ZengLZCHHB03
@article{DBLP:journals/ijces/ZengLZCHHB03, author = {Wenjiang Zeng and Huamao Lin and Xiaolin Zhang and Ramasamy Chockalingam and Wee Chong Heng and Sangki Hong and Narayanan Balasubramanian}, title = {Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices}, journal = {Int. J. Comput. Eng. Sci.}, volume = {4}, number = {2}, pages = {323--326}, year = {2003}, url = {https://doi.org/10.1142/S1465876303001186}, doi = {10.1142/S1465876303001186}, timestamp = {Thu, 09 Jul 2020 22:44:35 +0200}, biburl = {https://dblp.org/rec/journals/ijces/ZengLZCHHB03.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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