Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing.

Yubo Miao Chong Ser Chong Taichong Chai Yu Chen Quanbo Zou Tie Yan Chew-Kiat Heng Tit Meng Lim Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing. 235-238 2003 4 International Journal of Computational Engineering Science 2 http://dx.doi.org/10.1142/S1465876303000971 db/journals/ijces/ijces4.html#MiaoCCCZYHL03