BibTeX record journals/ieicetc/UedaW20

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@article{DBLP:journals/ieicetc/UedaW20,
  author       = {Naohiro Ueda and
                  Hirobumi Watanabe},
  title        = {Post-Packaging Simulation Based on {MOSFET} Characteristics Variations
                  Due to Resin-Molded Encapsulation},
  journal      = {{IEICE} Trans. Electron.},
  volume       = {103-C},
  number       = {6},
  pages        = {317--323},
  year         = {2020},
  url          = {https://doi.org/10.1587/transele.2019ECP5038},
  doi          = {10.1587/TRANSELE.2019ECP5038},
  timestamp    = {Mon, 18 Jan 2021 15:07:34 +0100},
  biburl       = {https://dblp.org/rec/journals/ieicetc/UedaW20.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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