Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology.

Hiroyuki Ito Hideyuki Sugita Kenichi Okada Tatsuya Ito Kazuhisa Itoi Masakazu Sato Ryozo Yamauchi Kazuya Masu Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology. 641-643 2007 90-C IEICE Transactions 3 http://dx.doi.org/10.1093/ietele/e90-c.3.641 db/journals/ieicet/ieicet90c.html#ItoSOIISYM07