Takashi Yoda Hirokazu Ezawa Kaori Tsutsumi Makoto Honda The sprint process of Al interconnects with low-temperature PVD via filling. 263-268 2004 1 IEICE Electronic Express 9 http://joi.jlc.jst.go.jp/JST.JSTAGE/elex/1.263 db/journals/ieiceee/ieiceee1.html#YodaETH04