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BibTeX record journals/ieiceee/WangY16
@article{DBLP:journals/ieiceee/WangY16, author = {Fengjuan Wang and Ningmei Yu}, title = {Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit {(3D} {IC)}}, journal = {{IEICE} Electron. Express}, volume = {13}, number = {11}, pages = {20151117}, year = {2016}, url = {https://doi.org/10.1587/elex.13.20151117}, doi = {10.1587/ELEX.13.20151117}, timestamp = {Fri, 12 Feb 2021 22:21:41 +0100}, biburl = {https://dblp.org/rec/journals/ieiceee/WangY16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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