Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

John U. Knickerbocker Paul S. Andry L. Paivikki Buchwalter Alina Deutsch Raymond R. Horton Keith A. Jenkins Young Hoon Kwark Gerald McVicker Chirag S. Patel Robert J. Polastre Christian D. Schuster Arun Sharma Sri M. Sri-Jayantha Christopher W. Surovic Cornelia K. Tsang Bucknell C. Webb Steven L. Wright Samuel R. McKnight Edmund J. Sprogis Bing Dang Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 725-754 2005 49 IBM Journal of Research and Development 4-5 http://dx.doi.org/10.1147/rd.494.0725 db/journals/ibmrd/ibmrd49.html#KnickerbockerABDHJKMPPSSSSTWWMSD05