Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors.

James N. Humenik James M. Oberschmidt Leon L. Wu Scott G. Paull Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors. 935-942 1992 36 IBM Journal of Research and Development 5 db/journals/ibmrd/ibmrd36.html#HumenikOWP92 http://dx.doi.org/10.1147/rd.365.0935