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BibTeX record journals/ibmrd/GuoLCW93
@article{DBLP:journals/ibmrd/GuoLCW93, author = {Yifan Guo and Chun K. Lim and William T. Chen and Charles G. Woychik}, title = {Solder Ball Connect {(SBC)} assemblies under thermal loading: I. Deformation measurement via moir{\'{e}} interferometry, and its interpretation}, journal = {{IBM} J. Res. Dev.}, volume = {37}, number = {5}, pages = {635--648}, year = {1993}, url = {https://doi.org/10.1147/rd.375.0635}, doi = {10.1147/RD.375.0635}, timestamp = {Fri, 13 Mar 2020 10:55:06 +0100}, biburl = {https://dblp.org/rec/journals/ibmrd/GuoLCW93.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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