BibTeX record journals/ibmrd/ChoiGLL93

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@article{DBLP:journals/ibmrd/ChoiGLL93,
  author       = {Hyung{-}Chu Choi and
                  Yifan Guo and
                  William LaFontaine and
                  Chun K. Lim},
  title        = {Solder Ball Connect {(SBC)} assemblies under thermal loading: {II.}
                  Strain analysis via image processing, and reliability considerations},
  journal      = {{IBM} J. Res. Dev.},
  volume       = {37},
  number       = {5},
  pages        = {649--660},
  year         = {1993},
  url          = {https://doi.org/10.1147/rd.375.0649},
  doi          = {10.1147/RD.375.0649},
  timestamp    = {Fri, 13 Mar 2020 10:55:09 +0100},
  biburl       = {https://dblp.org/rec/journals/ibmrd/ChoiGLL93.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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