BibTeX record journals/dt/HanLJZ15

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@article{DBLP:journals/dt/HanLJZ15,
  author       = {Yong Han and
                  Boon Long Lau and
                  Boo Yang Jung and
                  Xiaowu Zhang},
  title        = {Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level
                  Package},
  journal      = {{IEEE} Des. Test},
  volume       = {32},
  number       = {4},
  pages        = {32--39},
  year         = {2015},
  url          = {https://doi.org/10.1109/MDAT.2015.2440414},
  doi          = {10.1109/MDAT.2015.2440414},
  timestamp    = {Mon, 26 Oct 2020 08:27:29 +0100},
  biburl       = {https://dblp.org/rec/journals/dt/HanLJZ15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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