BibTeX record journals/dt/GongYC18

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@article{DBLP:journals/dt/GongYC18,
  author       = {Young{-}Ho Gong and
                  Jae Jeong Yoo and
                  Sung Woo Chung},
  title        = {Thermal Modeling and Validation of a Real-World Mobile {AP}},
  journal      = {{IEEE} Des. Test},
  volume       = {35},
  number       = {1},
  pages        = {55--62},
  year         = {2018},
  url          = {https://doi.org/10.1109/MDAT.2017.2695958},
  doi          = {10.1109/MDAT.2017.2695958},
  timestamp    = {Fri, 13 Mar 2020 14:35:39 +0100},
  biburl       = {https://dblp.org/rec/journals/dt/GongYC18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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