<?xml version="1.0"?>
<dblp>
<article key="journals/dt/DavisWMXHMSSF05" mdate="2006-04-27">
<author>W. Rhett Davis</author>
<author>John Wilson</author>
<author>Stephen Mick</author>
<author>Jian Xu</author>
<author>Hao Hua</author>
<author>Christopher Mineo</author>
<author>Ambarish M. Sule</author>
<author>Michael Steer</author>
<author>Paul D. Franzon</author>
<title>Demystifying 3D ICs: The Pros and Cons of Going Vertical.</title>
<pages>498-510</pages>
<year>2005</year>
<volume>22</volume>
<journal>IEEE Design &amp; Test of Computers</journal>
<number>6</number>
<ee>http://doi.ieeecomputersociety.org/10.1109/MDT.2005.136</ee>
<url>db/journals/dt/dt22.html#DavisWMXHMSSF05</url>
</article>
</dblp>
