3D Chip Stack Technology Using Through-Chip Interconnects.

Peter Benkart Alexander Kaiser Andreas Munding Markus Bschorr Hans-Jörg Pfleiderer Erhard Kohn Arne Heittmann Holger Huebner Ulrich Ramacher 3D Chip Stack Technology Using Through-Chip Interconnects. 512-518 2005 22 IEEE Design & Test of Computers 6 http://doi.ieeecomputersociety.org/10.1109/MDT.2005.125 db/journals/dt/dt22.html#BenkartKMBPKHHR05